藍寶石晶片
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Item
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4" |
Unit |
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Dimension |
Diameter:
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100 ± 0.15 |
mm |
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Thickness:
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650 ± 20 |
um |
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Primary Flat:
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30+1.0 |
mm |
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Orientation |
Surface-cut:
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C plane : Tilt 0.2°±0.1° in M axis / |
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Primary Flat:
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A plane : 0° ± 0.15° |
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Flatness |
Bow:
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0 ~ (-10) |
um |
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Warp:
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≤ 20 |
um |
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Total Thickness Variation (TTV):
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≤ 10 |
um |
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LTV
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≤2.5 |
um |
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Front side Roughness
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≤0.2 |
nm |
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Back side Roughness
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0.8-1.2 |
um |
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Cleanliness
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No particles and fingerprints |
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4.Material Quality
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High-purity mono-crystal Al2O3 |
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5.Package |
Wafers are packed in cleaned wafer cassettes containing 25 wafers under clean room environment.
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6.Trace Ability |
Wafers shall be traceable with respect to cassette number. The wafer box should be marked with a removable label showing the date, the cassette number and the quantity.
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7.Laser Mark |
Front or Back side
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