藍寶石晶片

Item

4"

Unit

 Dimension

Diameter:

100 ± 0.15

mm

Thickness:

650 ± 20

um

Primary Flat:

30＋1.0

mm

Orientation

Surface-cut:

C plane : Tilt 0.2°±0.1° in M axis /

~

Primary Flat:

A plane : 0° ± 0.15°

~

Flatness

Bow:

 0 ~ (-10)

um

Warp:

≤ 20

um

Total Thickness Variation (TTV):

≤ 10

um

LTV

≤2.5

um

Front side Roughness

≤0.2

nm

Back side Roughness

0.8-1.2

um

Cleanliness

No particles and fingerprints

~

4.Material Quality

High-purity mono-crystal Al2O3

~

5.Package

Wafers are packed in cleaned wafer cassettes containing 25 wafers under clean room environment.

~

6.Trace Ability

Wafers shall be traceable with respect to cassette number. The wafer box should be marked with a removable label showing the date, the cassette number and the quantity.

~

7.Laser Mark

Front or Back side

~